Qualcomm QCN9024

Qualcomm QCN9024 is a 5G NR (New Radio) chipset developed by Qualcomm. It is designed for use in mobile devices, including smartphones, tablets, and other mobile computing devices, to provide high-speed wireless connectivity.

Qualcomm QCN9024 chipset is part of the Snapdragon X60 5G Modem-RF System and is based on the 5nm process technology. It supports 5G NR sub-6GHz and mmWave bands, as well as 4G LTE, 3G, and 2G cellular technologies. It also supports advanced features like beamforming, MIMO (Multiple Input, Multiple Output), and dynamic spectrum sharing (DSS), which enable faster and more reliable wireless connectivity.

Qualcomm QCN9024 chipset is designed to provide enhanced performance and efficiency, with features like the Qualcomm® AI Engine and the Qualcomm® Sensing Hub. The AI Engine is a powerful AI processing engine that can deliver up to 26 TOPS (tera operations per second) of AI performance. The Sensing Hub is a low-power processing hub that can handle sensor data processing in an efficient and power-saving way.

Overall, Qualcomm QCN9024 chipset is a powerful and efficient solution for mobile devices that require high-speed and reliable 5G wireless connectivity, as well as advanced AI and sensor processing capabilities.

Description

MX6924 F5 802.11ax Embedded Wireless modules is an embedded wireless module that adopts M.2 E-key and supports PCI Express 3.0 protocol.

It adopts Qualcomm® 802.11ax Wi-Fi technology, supports the 5180-5850GHz frequency band, has AP and STA functions with 4x4 MIMO and 4 spatial streams, suitable for applications of 5GHz IEEE802.11a/n/ac/ax.

It is equipped with a dynamic frequency selection (DFS) function which has higher transmission efficiency than the previous.

Specifications

Type: Wireless Module

Chip: Qualcomm QCN9024

IEEE Standard: IEEE 802.11ax

Connector: PCI Express 3.0, M.2 E-key

Working voltage: 3.3V

Frequency range: 51805320GHz 57455825GHz

Modulation technology:

802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM) ;802.11ac: OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM) ;

802.11ax: OFDMA (BPSK, QPSK, DBPSK, DQPSK, 16-QAM, 64-QAM, 256-QAM, 1024-QAM, 4096-QAM)

power (per chain): 802.11ax: Max. 24dBm

Power consumption: ≦15W

Receiving Sensitivity: 11ax:HE20 MCS0 <-95dBm / MCS11 <-62dBm;HE40 MCS0 <-89dBm / MCS11 <-60dBm;HE80 MCS0 <-86dBm / MCS11 <-56dBm;HE160 MCS0 <-87dBm / MCS9 <-64dBm

Antenna Connector: 4 x U. FL

Operating Environment: Temperature: -20°C to 70°C/-4 ~ 158℉; Humidity: 95% (non-condensing)

Storage Environment: Temperature: -40°C to 90°C/-40 ~ 194℉; Humidity: 90% (non-condensing)

Certification: RoHS/REACH

Weight: 18g

Dimensions (WHD): 55.9 x 52.8x 8.5 mm (±0.1mm)